Journal
SCRIPTA MATERIALIA
Volume 57, Issue 10, Pages 968-971Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2007.06.067
Keywords
void; porous anodic alumina; Si; barrier layer
Categories
Funding
- National Research Foundation of Korea [R01-2005-000-10553-0] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Ask authors/readers for more resources
Preparation of a porous anodic alumina (PAA) template, directly formed on Si, is known to form the nanosized interfacial voids between the alumina film and Si substrate. The presence of interfacial voids, however, complicates the organization of reliable contacts between the nanopores (or nanowires) and substrate. In this paper, a process of void formation according to the inversion behavior of the barrier layers is described experimentally. Interestingly, the compositional morphology which surrounded the voids reflected a bilayered feature that consisted of thin (1-5 nm) Al-rich and thick (similar to 20 nm) Al-poor regions, implying that these voids were formed physically, rather than chemically. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available