On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites

The evolution of the thermal conductivity and the coefficient of thermal expansion as a function of the alloying content of boron and chromium in the copper matrix in Cu-X/diamond composites is presented. In both systems a transition from weak matrix/diamond bonding to strong bonding is observed, the latter leading concomitantly to high thermal conductivity (> 600 W m(-1) K-1) and a low coefficient of thermal expansion (< 10 ppm K-1). (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.