4.3 Article

Energy dissipation mechanism of phononic friction

Journal

ACTA PHYSICA SINICA
Volume 58, Issue 12, Pages 8522-8528

Publisher

CHINESE PHYSICAL SOC
DOI: 10.7498/aps.58.8522

Keywords

interfacial friction; stick-slip; phonon; temperature rise

Funding

  1. National Natural Science Foundation of China [50675068, 50875087]
  2. Science Foundation for Postdoctor of China [20070410819]

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Focusing on the interfacial friction, the energy accumulation and dissipation mechanisms are analyzed in the present paper. Based on the lattice thermokinetics theory, the potential difference of interfacial atom during the jumping process is calculated, then the formula of interfacial temperature rise is deduced successfully. The analysis indicates that the interfacial temperature depends on the contact status and material properties of the friction system, and the interfacial interactive potential is an important factor. In the initial stage of slipping process, as the interfacial atoms are in the non-equilibrium thermal state, new phonon are excited to enable the friction energy dissipation, which finally makes the non-thermal equilibrium transit to equilibrium state. Based on the quantum mechanics and the thermodynamics, the energy dissipation mechanism of interfacial friction is studied. The results show that the elastic potential energy stored during the sticking process dissipates more quickly with higher vibration frequency, and the dissipation time is much shorter than the slip time in one cycle.

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