4.8 Article

Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking

Journal

ADVANCED MATERIALS
Volume 26, Issue 33, Pages 5857-5862

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201401736

Keywords

thermal interface materials; vertically aligned carbon fibers; electrostatic flocking; through-plane thermal conductivity

Funding

  1. Technology Research Association for Single Wall Carbon Nanotubes (TASC)

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