Journal
ADVANCED MATERIALS
Volume 23, Issue 21, Pages 2454-+Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201004656
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Funding
- National Science Council of Republic of China, Taiwan
- U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences [DE-SC0001299]
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Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. [GRAPHICS] .
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