Journal
ADVANCED MATERIALS
Volume 22, Issue 21, Pages 2320-2324Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.200904410
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Funding
- NIH [1-DP2-OD004346-01]
- National Science Foundation (NSF) [0854881]
- Div Of Civil, Mechanical, & Manufact Inn
- Directorate For Engineering [0854881] Funding Source: National Science Foundation
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We demonstrate the concept of inducing stresses in thin films post-deposition (extrinsic stress) to curve nanostructures on demand. The remarkably high extrinsic stress, induced by triggering grain coalescence in Sn thin films, was used to self-assemble 3D nanostructures with radii of curvature as small as 20 nm. The fabrication methodology required only simple processing steps and the self-assembly process was highly parallel. Curved nanostructures with any desired pattern and both homogeneous (rings, tubes) and variable radii of curvature (spirals, talons) could be constructed.
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