Journal
ADVANCED FUNCTIONAL MATERIALS
Volume 23, Issue 33, Pages 4087-4093Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.201300127
Keywords
transient electronics; fully formed electronic devices; bioresorbable electronics; biocompatible electronics
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Funding
- Defense Advanced Research Projects Agency
- Ministry of Science, ICT & Future Planning, Republic of Korea [IBS EM1301] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, transient electronic devices.
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