Journal
ACTA MATERIALIA
Volume 60, Issue 10, Pages 4336-4348Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2012.04.018
Keywords
Pb-free solder; Mechanical shock; Fracture; Cu6Sn5; Strain rate
Funding
- National Science Foundation Division of Materials Research - Metals Division
- Division Of Materials Research
- Direct For Mathematical & Physical Scien [0805144] Funding Source: National Science Foundation
Ask authors/readers for more resources
Solders serve as electrical and mechanical interconnects in electronic packaging. The mechanical shock behavior of a Pb-free solder joint is quite complex, since the influences of solder microstructure, intermetallic compound (IMC) layer thickness, and strain rate on the overall dynamic solder joint strength need to be quantified. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it should be controlled by the bulk solder, whereas at high strain rates it may be controlled by the brittle intermetallic compound layer. In this paper, the dynamic solder joint strength of Sn-3.9 Ag-0.7 Cu solder joints was experimentally measured over the strain rate range 10(-3)-12 s(-1). The influences of changes in solder microstructure and IMC layer on dynamic solder joint strength were quantified, and visualized in three dimensions. Fracture mechanisms operating in the solder-controlled and IMC layer-controlled dynamic strength regimes are discussed. Finally, qualitative numerical simulations were conducted, which accurately depict the experimentally observed fracture behaviors. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available