Journal
ACS NANO
Volume 8, Issue 9, Pages 8746-8756Publisher
AMER CHEMICAL SOC
DOI: 10.1021/nn5037587
Keywords
transfer printing methods; thin film solar cells; flexible solar cells; epitaxial lift-off method; epitaxial layer transfer method; controlled spalling method; peel-and-stick method
Categories
Funding
- Samsung Advanced Institute of Technology (SAIT) [IC2012-1318]
- Samsung R&D Center America, Silicon Valley (SRA-SV)
- Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Education, Science and Technology [NRF-2012R1A1A1043135]
- Intelligent Synthetic Biology Center of Global Frontier Project - Ministry of Education, Science and Technology of Korea [NRF-2012M3A6A8054889]
- National Research Foundation of Korea [2011-0031957, 2012R1A1A1043135] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Fabricating thin film solar cells (TFSCs) on flexible substrates will not only broaden the applications of solar cells, but also potentially reduce the installation cost. However, a critical challenge for fabricating flexible TFSCs on flexible substrates is the incompatibility issues between the thermal, mechanical, and chemical properties of these substrates and the fabrication conditions. Transfer printing methods, which use conventional substrates for the fabrication and then deliver the TFSCs onto flexible substrates, play a key role to overcome these challenges. In this review, we discuss the basic concepts and working principles of four major transfer printing methods associated with (1) transfer by sacrificial layers, (2) transfer by porous Si layer, (3) transfer by controlled crack, and (4) transfer by water-assisted thin film delamination. We also discuss the challenges and opportunities for implementing these methods for practical solar cell manufacture.
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