4.8 Article

Pseudonegative Thermal Expansion and the State of Water in Graphene Oxide Layered Assemblies

Journal

ACS NANO
Volume 6, Issue 9, Pages 8357-8365

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/nn3031244

Keywords

graphene oxide; GO; negative thermal expansion; layered; water adsorption; coefficient of thermal expansion; CTE

Funding

  1. AFOSR Mechanics of Multifunctional Materials & Microsystems Program [FA9550-08-1-0382]
  2. Center for Solar and Thermal Energy Conversion
  3. Energy Frontier Research Center
  4. U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences [DE-SC0000957]
  5. Center for Photonic and Multiscale Nanomaterials (C-PHOM)
  6. National Science Foundation Materials Research Science and Engineering Center program [DMR 1120923]
  7. NSF [ECS-0601345, EFRI-BSBA 0938019, CBET 0933384, CBET 0932823, CBET 1036672, DMR-9871177]
  8. Army SBIR [A10-123]
  9. Directorate For Engineering
  10. Emerging Frontiers & Multidisciplinary Activities [0938019] Funding Source: National Science Foundation

Ask authors/readers for more resources

Unraveling the complex interplay between thermal properties and hydration is a part of understanding the fundamental properties of many soft materials and very essential for many applications. Here we show that graphene oxide (GO) demonstrates a highly negative thermal expansion (NTE) coefficient owing to unique thermohydration processes related with fast transport of water between the GO sheets, the amphiphilic nature of nanochannels, and close-to-zero intrinsic thermal expansion of GO. The humidity-dependent NTE of GO layered assemblies, or pseudonegative thermal expansion (PNTE), differs from that of other hygroscopic materials due to its relatively fast and highly reversible expansion/contraction cycles and occurrence at low humidity levels while bearing similarities to classic NTE. Thermal expansion of polyvinyl alcohol/GO composites is easily tunable with additional intricacy of thermohydration effects. PNTE combined with isotropy, nontoxicity, and mechanical robustness is an asset for applications of actuators, sensors, MEMS devices, and memory materials and crucial for developing methods of thermal/photopatterning of GO devices.

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