Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 6, Issue 9, Pages 6481-6486Publisher
AMER CHEMICAL SOC
DOI: 10.1021/am500009p
Keywords
copper nanowires; growth; composites; thermal interface materials; thermal conductivity; percolation
Funding
- National Natural Science Foundation of China [61301036]
- Shanghai Municipal Natural Science Foundation [13ZR1463600]
- Shanghai Institute of Ceramics
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Thermal interface materials (TIMs) are of ever-rising importance with the development of modern microelectronic devices. However, traditional TIMs exhibit low thermal conductivity even at high loading fractions. The use of high-aspect-ratio material is beneficial to achieve low percolation threshold for nanocomposites. In this work, single crystalline copper nanowires with large aspect ratio were used as filling materials for the first time. A thermal conductivity of 2.46 W/mK was obtained at an ultralow loading fraction, similar to 0.9 vol %, which was enhanced by 1350% compared with plain matrix. Such attractive fillers for high-performance TIMs. an excellent performance makes copper nanowires
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