Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 4, Issue 12, Pages 6587-6598Publisher
AMER CHEMICAL SOC
DOI: 10.1021/am301723d
Keywords
atmospheric plasma deposition; precursor chemical structure; silica molecular structure; elastic property; adhesion
Funding
- Director, Office of Energy Research, Office of Basic Energy Sciences, Materials Sciences Division of the U.S. Department of Energy [DE-FG02-07ER46391]
- Boeing Company
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We explore the application of a high-temperature precursor delivery system for depositing high boiling point organosilicate precursors on plastics using atmospheric plasma. Dense silica coatings were deposited on stretched poly(methyl methacrylate), polycarbonate and silicon substrates from the high boiling temperature precursor, 1, 2-bis(triethoxysilyl)ethane, and from two widely used low boiling temperature precursors, tetraethoxysilane and tetramethylcyclotetrasiloxane. The coating deposition rate, molecular network structure, density, Young's modulus and adhesion to plastics exhibited a strong dependence on the precursor delivery temperature and rate, and the functionality and number of silicon atoms in the precursor molecules. The Young's modulus of the coatings ranged from 6 to 34 GPa, depending strongly on the coating density. The adhesion of the coatings to plastics was affected by both the chemical structure of the precursor and the extent of exposure of the plastic substrate to the plasma during the initial stage of deposition. The optimum combinations of Young's modulus and adhesion were achieved with the high boiling point precursor which produced coatings with high Young's modulus and good adhesion compared to commercial polysiloxane hard coatings on plastics.
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