4.8 Article

Self-Healing Epoxy Composite with Heat-Resistant Healant

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 3, Issue 11, Pages 4487-4495

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/am201182j

Keywords

self-healing; thermal stability; high-temperature cured epoxy composites; fracture; fatigue

Funding

  1. Natural Science Foundation of China [U0634001, 50903095, 20874117, 50573093, 51073176]
  2. Ministry of Education of China [20090171110026]
  3. Science and Technology Program of Guangdong Province [2010B-010800021]
  4. China Postdoctoral Science Foundation
  5. Fundamental Research Funds for the Central Universities

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To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel micro-encapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as the catalyst. Because of the higher thermal stability of EPON 828 and lower volatility of DMP-30, the healing agent and the self-healing composite not only survive high-temperature curing and thermal exposure, but also offer satisfactory capability of autonomous properties restoration, as characterized by both fracture mechanics and fatigue tests. Especially when the operation temperature is not higher than 200 degrees C, the performance of the healing system is nearly independent of thermal history.

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