4.8 Article

All Solution-Processed, Fully Transparent Resistive Memory Devices

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 3, Issue 11, Pages 4525-4530

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/am201215e

Keywords

transparent electronics; transparent memory device; solution processing; indium tin oxide; resistive random access memory; zinc oxide

Funding

  1. National Research Foundation of Korea (NRF)
  2. Ministry of Education, Science and Technology [2009-0086302]
  3. Brain Korea 21 Project

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We fabricated all-solution processed, fully transparent resistive random access memory (sol-TRRAM) with a configuration of ITO/GaZnO(GZO)/ITO. All layers, including an active layer and top and bottom ITO electrodes, were deposited on a glass substrate by either spin coating or inkjet printing using a sol gel solution. Our sol-TRRAM was transparent, with 86.5% transmittance at 550 rim. An initial forming process is unnecessary for the production of transparent memory due to the presence of sufficient inherent nonlattice oxygen ions in the solution-processed GZO layer. The sol-TRRAM also showed reasonable bipolar resistance switching with a low operation current (<100 mu A) and excellent cycle endurance properties (>300 cycles). The main conduction mechanism during the set process can be explained by the trap-controlled space-charge limited conduction, and the resistance change occurred by the modification of the potential barrier height because of the charge injection by Fowler-Nordheim tunneling.

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