Journal
IEEE ACCESS
Volume 6, Issue -, Pages 8123-8132Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/ACCESS.2018.2795382
Keywords
Compact model; efficiency of TEG; mu TEG; thermal resistance; UMC; 0.13 mu m CMOS
Categories
Funding
- Zewail City of Science and Technology, ASRT
- Deepen Local Manufacturing Electronics Industry
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In this paper, an accurate thermal resistance model for a micro-thermoelectric generator (mu TEG) designed using standard complementary metal-oxide-semiconductor (CMOS) technology is presented. The optimal dimensions for the mu TEG are determined based on the new mu TEG thermal model. The presented models are verified with three-dimensional numerical simulations and compared to published experimental results and the presented models exhibited very good accuracy. An improved output power is obtained when using the new thermal resistance model to determine accurate optimal device dimensions. In this paper, a 1-cm(2) cross sectional area mu TEG based on a 0.13 mu m UMC standard CMOS technology is proposed. An output power of 9.25 mu W is produced at 2.34 K of temperature difference between the hot and cold sides of the mu TEG. The introduced compact models for thermal resistance and the delivered power model are compatible with SPICE based simulators and hence can be integrated with circuit simulations.
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