4.6 Article

Reliable Ge2Sb2Te5-Integrated High-Density Nanoscale Conductive Bridge Random Access Memory using Facile Nitrogen-Doping Strategy

Journal

ADVANCED ELECTRONIC MATERIALS
Volume 4, Issue 11, Pages -

Publisher

WILEY
DOI: 10.1002/aelm.201800360

Keywords

conduction mechanisms; GexSbxTey; nitrogen doping; phase change materials; resistive switching memory

Funding

  1. National Research Foundation of Korea (NRF) - Ministry of Science, ICT and Future Planning (MSIP) of the Korean government [NRF-2017R1E1A1A03070501, NRF-2015R1A5A1037668, CAMM-2014M3A6B3063708]
  2. KRF fellowship from NRF-MSIP of Korean government [NRF-2017H1D3A1A02011379]

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Conductive bridge random access memory (CBRAM) is a possible replacement for static field-programmable gate arrays (FPGAs) based on randomaccess memory. Ge2Sb2Te5 (GST) is used in CBRAMs as a solid electrolyte due to its high diffusion properties of active ions and scalability to obtain high-density memory devices. Here, the trade-off between high memory window and uniformity of CBRAM based on GST is solved by introducing N atoms into the SE. Nitrogen-incorporated GST film (N-GST) is proposed as a replacement for the current GST-based CBRAMs with improved performance and better opportunities for conventional FPGA technologies. A bidirectional polarity-dependent characteristic with high I-ON/I-OFF ratio and satisfactory operation voltage is achieved by using N-GST thin film in a programmable metallization cell (PMC). Integration of N atoms in the GST-based PMC with a simple structure of Ag/ N-GST / Pt increases the resistance ratio more than 100 times compared to an undoped one. Consistent data retention is attained in both resistance states for >= 3.5 x 10(4) s at temperature up to 85 degrees C.

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