Journal
ADVANCED ELECTRONIC MATERIALS
Volume 4, Issue 2, Pages -Publisher
WILEY
DOI: 10.1002/aelm.201700434
Keywords
3D integration; electronic skin; gallium-based liquid metal (eutectic gallium-indium alloy, EGaIn); soft physical microsystems; stretchable electronics
Funding
- National Science Foundation [ECCS-1542174]
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This paper presents 3D-integrated and multifunctional all-soft physical microsystems, which are composed of a soft sensor, a soft interconnector, and a soft readout circuit. The microsystems utilize gallium-based liquid metal (eutectic gallium-indium alloy, EGaIn) and poly(dimethylsiloxane) (PDMS) and are fabricated using an advanced EGaIn thin-line patterning technique based on soft lithography. Combining the scalable fabrication process and a vertical integration approach using EGaIn-filled soft vias, two types of all-soft physical microsystems are investigated using analytical, numerical, and experimental approaches and demonstrated to highlight high-density integration, multifunctional sensing capability, as well as system-level flexibility and stretchability: (i) a finger-mountable strain sensing microsystem with reduced temperature sensitivity and (ii) a fingertip microsystem for simultaneous proximity, touch, and pressure sensing. The demonstrated fabrication and integration approaches provide a path towards all-soft and highly integrated wearable physical microsystems for human-machine interfaces, soft robotics, and healthcare applications.
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