4.8 Article

Modeling, Design, and Fabrication of High-Inductance Bond Wire Microtransformers With Toroidal Ferrite Core

Journal

IEEE TRANSACTIONS ON POWER ELECTRONICS
Volume 30, Issue 10, Pages 5724-5737

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2014.2370814

Keywords

Bonding processes; converters; energy harvesting (EH); ferrites; magnetic cores; oscillators; permeability; power supply in package (PwrSiP); power supply on chip (PwrSoC); printed circuits; thermoelectric; transformers

Funding

  1. European Community [257375]
  2. ENIAC-JTI [LAB4MEMs 325622]

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This paper presents the design of miniaturized bond wire transformers assembled with standard IC bonding wires and NiZn and MnZn ferrite toroidal cores. Several prototypes are fabricated on a printed circuit board substrate with various layouts in a 4.95 mm x 4.95 mm area. The devices are modeled by analytical means and characterized with impedance measurements over a wide frequency range. Experimental results on 1: 38 device show that the secondary self-inductance increases from 0.3 mu H with air-core to 315 mu H with ferrite core; the coupling coefficient improves from 0.1 with air-core to 0.9 with ferrite core; the effective turns ratio enhances from 0.5 with air-core to 34 with ferrite core. This approach is cost effective and enables a flexible design of efficient micromagnetics on top of ICs with dc inductance to resistance ratio of 70 mu H/Omega and an inductance per unit area of 12.8 mu H/mm(2) up to 0.3 MHz. The design targets the development of bootstrap circuits for ultralow voltage energy harvesting. In this context, a low-voltage step-up oscillator suitable for thermoelectric generator sources is realized with a commercial IC and the proposed micro-transformers. Experimental measurements on a discrete prototype report that the circuit bootstraps from voltages down to 260 mV and outputs a dc voltage of 2 V.

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