Related references
Note: Only part of the references are listed.Al-Al thermocompression bonding for wafer-level MEMS sealing
N. Malik et al.
SENSORS AND ACTUATORS A-PHYSICAL (2014)
Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles
Shuji Tanaka et al.
SENSORS AND ACTUATORS A-PHYSICAL (2012)
Glass frit bonding: an universal technology for wafer level encapsulation and packaging
R Knechtel
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2005)
Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength
TC Yi et al.
SENSORS AND ACTUATORS A-PHYSICAL (2000)
Share Paper
