4.5 Article

Characterization of Stress in Thallium Bromide Devices

Journal

IEEE TRANSACTIONS ON NUCLEAR SCIENCE
Volume 62, Issue 2, Pages 437-442

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TNS.2015.2400396

Keywords

Birefringence; bulk defects; dislocations; extended defects; ionic polarization; long term performance; photoelasticity; pockels effect; semiconductor crystal growth; semiconductor device breakdown; semiconductor radiation detectors; stress analysis; tlBr detectors; tlBr device lifetime; wide band gap semiconductors

Funding

  1. U.S. Department of Homeland Security, Domestic Nuclear Detection office [HSHQDC-13-C-0082]

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Thallium bromide (TlBr) is a wide bandgap, compound semiconductor with high gamma-ray stopping power and promising physical properties. Several surface modification techniques have been demonstrated to increase the lifetime of TlBr devices at room temperature. However, absence of reproducibility in the performance of TlBr detectors (even with low ionic conduction at -20 degrees C) suggests presence of unexplored bulk phenomena. Stress in the TlBr crystal due to various intrinsic (e. g. grain boundaries and dislocations networks) in conjunction with external factors such as thermal, mechanical, and electrical loadings explains detector-to-detector variations. Photoelasticity and opto-electrical techniques were applied to visualize and qualitatively correlate the device performance with stress. Changes in stress patterns with variations in ambient temperature were clearly demonstrated. Electric field fluctuations in TlBr detectors with time were for the first time observed using the Pockels effect.

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