4.5 Article

Fabrication and Characterization of a High-Power Assembly With a 20-Junction Monolithically Stacked Laser Power Converter

Journal

IEEE JOURNAL OF PHOTOVOLTAICS
Volume 8, Issue 5, Pages 1355-1362

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JPHOTOV.2018.2841195

Keywords

High-power assembly; high-voltage; monolithically stacked laser power converter; narrow-band light; three-dimensional (3-D) thermal model; 20-junction (20J)

Funding

  1. HBSKFZD from the open foundation of the Hubei Collaborative Innovation Center for High-Efficiency Utilization of Solar Energy [2016001, 2014002]
  2. State Grid Corporation of China in 2017 Power by Laser Key Technology Research (SGRIXTKJ[2017]) [840]
  3. AOV Energy Inc.
  4. Huaxing Laser Inc.

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Anincreasing number of applications require an electrical source with good insulation and high power. Power over fiber (POF) technology has excellent insulating characteristics and thus is attracting increasing attention. The high-voltage laser power converter (HVLPC) is the most important component in the entire POF system, and the monolithically stacked HVLPC, because of its excellent performance characteristics, is particularly suitable for the requirements of high power. In this paper, we designed and prepared a compact high-power assembly with a 20-junction monolithically stacked HVLPC, and the performance characteristics of the designed assembly were separately tested under laser powers from 2 to 43 W with an 808 nm wavelength. More than 20 W of electric power was extracted under 43 W of laser power, and a maximum photon-energy conversion efficiency of 50.4% was observed with an open-circuit voltage of 22.15 V. Additionally, the temperature characteristics of the designed assembly under different laser powers and different loads were separately discussed, and a three-dimensional thermal simulation model for the designed assembly was established to predict the optimized passive heat sink structure. According to the research conclusions in this paper, additional types of high-power assemblies can be similarly designed in the future.

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