Journal
JOURNAL OF ADVANCED PHYSICS
Volume 1, Issue 1, Pages 48-53Publisher
AMER SCIENTIFIC PUBLISHERS
DOI: 10.1166/jap.2012.1011
Keywords
Polyimide; Thermal Expansion; Dielectric Properties; Zirconium Tungstate
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Funding
- NSF of China [50977001, 51073015]
- State Key Laboratory of Power System [SKLD11KZ04]
- State Key Laboratory of Electrical Insulation and Power Equipment [EIPE12208, EIPE12207]
- Ministry of Sciences and Technology of China through China-Europe International Incorporation Project [2010DFA51490]
- China Postdoctoral Science Foundation [KM201210012010]
- Fundamental Research Funds for the Central Universities
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Zirconium tungstate (ZrW2O8 ) has negative thermal expansion characteristics and was obtained through direct solid- state reaction by sintering at 1200 degrees C for 24 h. Subsequently ZrW2O8/polyimide (ZWO/PI) hybrid films were prepared and their coefficient of thermal expansion (CTE) as well as dielectric properties was investigated. In the range of 0- 35 wt% ZWO, the value of the CTE of the ZWO/PI hybrid films decreased with increasing loading in ZWO while their dielectric constant increased from 3.26 to 4.01, which remained low. Moreover, the dielectric constant of the ZWO/PI hybrid films containing 15 wt% ZWO exhibited a very small temperature dependence from -50 to 150 degrees C. All these results suggest the ZWO/PI hybrid films can be used as packaging materials for electronic devices owing to their low CTE and low dielectric constant at wide frequency and broad temperature ranges.
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