Journal
ACTA METALLURGICA SINICA-ENGLISH LETTERS
Volume 32, Issue 3, Pages 332-342Publisher
CHINESE ACAD SCIENCES, INST METAL RESEARCH
DOI: 10.1007/s40195-018-0749-x
Keywords
Ultrasonic-assisted soldering; Ultrasonic effect mechanism; Microjet; Intermetallic compound distribution; Solid solution; Joint strengthening
Categories
Funding
- State Key Laboratory of Advanced Brazing Filler Metals Technology [SKLABFMT-2016-02]
- CAST Innovation Fund Key Project
- National Natural Science Foundation of China [51775299, 51520105007]
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A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn-xZn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa at soldering temperature of 300 degrees C under ultrasonic assistance for only 5 s using Sn-20Zn solder. The fracture path propagates completely in the soldering seam. The results indicate that the microjet generated by ultrasonic pressure in liquid solder could strike and splinter the Mg2Sn intermetallic compounds into small pieces, which contributes to the enhancement of the joint strength. In addition, the primary Al(Zn) solid solution phase formed during cooling stage could also strengthen the joint due to the prevention of microcracks propagation.
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