Journal
ULTRASONICS SONOCHEMISTRY
Volume 42, Issue -, Pages 403-410Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.ultsonch.2017.12.005
Keywords
Ultrasonic soldering; Homogenization; (Cu, Ni)6Sns joints; Grain morphology; Concentration gradient
Categories
Funding
- Shandong Provincial Natural Science Foundation of China [ZR2016EEQ12]
- Researching Innovation Fund of Harbin Institute of Technology [HIT. NSRIF. 2016091]
- National Natural Science Foundation of China [51775138]
- International Science & Technology Cooperation Program of China [2015DFA50470]
Ask authors/readers for more resources
Homogeneous (Cu, Ni)(6)Sn-5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni)(6)Sn-5 and minor Cu3Sn IMCs, and the grain morphology of (Cu, Ni)(6)Sn-5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni)(6)Sn-5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa).
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available