Journal
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
Volume 25, Issue 3, Pages -Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2014.2371693
Keywords
Anisotropy; EBSD; elastic modulus; Nb3Sn; tensile test; texture
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The elastic anisotropy caused by the texture in the Nb3Sn filaments of PIT and RRP wires has been calculated by averaging the estimates of Voigt and Reuss, using published Nb3Sn single crystal elastic constants and the Nb3Sn grain orientation distribution determined in both wire types by Electron Backscatter Diffraction. At ambient temperature the calculated Nb3Sn E-moduli in axial direction in the PIT and the RRP wire are 130 GPa and 140 GPa, respectively. The calculated E-moduli are compared with tensile test results obtained for the corresponding wires and extracted filament bundles.
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