Journal
IEEE SENSORS JOURNAL
Volume 15, Issue 9, Pages 5202-5207Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSEN.2015.2439265
Keywords
Gallium nitride (GaN); dark current; metal-semiconductor-metal (MSM); passivation; photodetector (PD); surface leakage; ultraviolet (UV)
Funding
- Ministry of Science and Technology, Taiwan [MOST 103-2221-E-006-238-MY3, MOST 104-2218-E-035-009]
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This paper proposes the H2O2 oxidation technique to grow Al2O3 as the surface passivation layer of the metal-semiconductor-metal ultraviolet (UV) photodetector (PD). The dark current of the H2O2-grown-Al2O3-passivated PD was reduced from 104 to 4.43 nA. The surface leakage of the PD was reduced from 65.7 nA/1.67 mu A to 0.46 nA/0.5 nA in the dark/under illumination. It was found that similar to 35% photocurrent results from the surface leakage. The surface leakages in the H2O2-grown-Al2O3 passivated and the plasma-enhanced chemical vapor deposition (PECVD)-grown-SiO2 passivated PDs were reduced significantly. Although the photocurrent and the photoresponsivity of the oxide-passivated PDs were lower than those of the unpassivated one, the dark current, UV-to-visible rejection ratio, noise equivalent power, and the detectivity of the oxide-passivated PDs were better than those of the unpassivated one. In addition, the performances of the H2O2-grown-Al2O3 passivated PD were better than those of the PECVD-grown-SiO2 passivated one.
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