Journal
SMALL
Volume 14, Issue 20, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.201704332
Keywords
electrical conductivity; electromagnetic interference shielding; films; large flake size graphene; thermal conductivity
Categories
Funding
- National Natural Science Foundation of China [51372186, 51672204, 51701146, 51402228]
- EPSRC [EP/K005014/1] Funding Source: UKRI
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To guarantee the normal operation of next generation portable electronics and wearable devices, together with avoiding electromagnetic wave pollution, it is urgent to find a material possessing flexibility, ultrahigh conductive, and superb electromagnetic interference shielding effectiveness (EMI SE) simultaneously. In this work, inspired by a building bricks toy with the interlock system, we design and fabricate a copper/large flake size graphene (Cu/LG) composite thin film (approximate to 8.8 mu m) in the light of high temperature annealing of a large flake size graphene oxide film followed by magnetron sputtering of copper. The obtained Cu/LG thin-film shows ultrahigh thermal conductivity of over 1932.73 (+/- 63.07) W m(-1) K-1 and excellent electrical conductivity of 5.88 (+/- 0.29) x 10(6) S m(-1). Significantly, it also exhibits a remarkably high EMI SE of over 52 dB at the frequency of 1-18 GHz. The largest EMI SE value of 63.29 dB, accorded at 1 GHz, is enough to obstruct and absorb 99.99995% of incident radiation. To the best of knowledge, this is the highest EMI SE performance reported so far in such thin thickness of graphene-based materials. These outstanding properties make Cu/LG film a promising alternative building block for power electronics, microprocessors, and flexible electronics.
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