Journal
SENSORS AND ACTUATORS A-PHYSICAL
Volume 279, Issue -, Pages 671-679Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2018.06.021
Keywords
Heterogeneous integration; Wafer-level hermetic packaging; Cu-Cu thermo-compression bonding; Single-point diamond fly-cutting
Funding
- New Energy and Industrial Technology Development Organization (NEDO)
- 'Nanotechnology Platform' of the Ministry of Education, Culture, Sports, Science, and Technology (MEXT), Japan
- Program for Leading Graduate Schools, 'Inter-Graduate School Doctoral Degree Program on Global Safety' of the MEXT, Japan
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Hermetic packaging plays an important role for optimizing the functionality and reliability of a wide variety of micro-electro-mechanical systems (MEMS). In this paper, we propose a low-temperature wafer-level hermetic packaging method based on the thermo-compression bonding process using an electroplated Cu sealing frame planarized by a single-point diamond mechanical fly-cutting. This technology has an inherent possibility of hermetic sealing and electrical contact as well as a capability of integration of micro-structured wafers. Hermetic sealing can be realized with the sealing frame as narrow as 30 mu m at a temperature as low as 250 degrees C. At such a low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100 Pa. The leak rate into the packages is estimated by a long-term sealed cavity pressure measurement for 7 months to be less than 1.67 x 10(-15) Pa m(3) s(-1). In addition, the bonding shear strength is also evaluated to be higher than 100 MPa. (C) 2018 Elsevier B.V. All rights reserved.
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