Journal
THERMEC 2011, PTS 1-4
Volume 706-709, Issue -, Pages 2962-+Publisher
TRANS TECH PUBLICATIONS LTD
DOI: 10.4028/www.scientific.net/MSF.706-709.2962
Keywords
Ag2O particles; Pb-free; Ag nanoparticles; Electronics packaging; Sintering bonding
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Funding
- Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan
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A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.
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