Journal
IEEE ELECTRON DEVICE LETTERS
Volume 36, Issue 9, Pages 932-934Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2015.2458899
Keywords
Gallium nitride; passivation; PIN; power devices
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Funding
- Department of Industrial Technology Ministry of Economic Affairs, China [103-EC-17-A-01-S1-217]
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Trifluoromethane-containing plasma is used to passivate the mesa surfaces and suppresses the surface leakage current of GaN p-i-n rectifiers. Reduction of surface leakage enhances the reverse blocking voltage by 25% measured at J = 1 A/cm(2). Differential forward resistances of control samples and plasma-treated ones are 0.65 and 0.49 m Omega-cm(2), respectively, and an excellent Baliga's figure-of-merit of more than 800 MW/cm(2), as compared with the conventional 545 MW/cm(2), is achieved for GaN diodes fabricated on sapphire substrates.
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