Journal
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA
Volume 115, Issue 31, Pages E7236-E7244Publisher
NATL ACAD SCIENCES
DOI: 10.1073/pnas.1806640115
Keywords
transfer printing method; thin-film nanoelectronics; Internet of Things; delamination; nondestructive wafer recycling
Categories
Funding
- Purdue University
- Air Force Research Laboratory [S-114-054-002]
- National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation Grant [1728149]
- University of Virginia
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Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.
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