Journal
ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES XI
Volume 195, Issue -, Pages 235-+Publisher
TRANS TECH PUBLICATIONS LTD
DOI: 10.4028/www.scientific.net/SSP.195.235
Keywords
high aspect ratio structures; wetting; Cassie-Baxter; Wenzel; pattern collapse
Ask authors/readers for more resources
In semiconductor fabrication, pattern collapse of high aspect ratio structures after wet processing has been a critical issue and attracted a lot of interest. On the other hand, very little attention is spent on the potential wetting issues as feature dimensions are continuously scaled down and novel materials with different wetting properties are used in new technology nodes. In this work we investigate the wettability of nano-patterned silicon substrates with different surface modifications.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available