Investigation of the evaporation and wetting mechanism of IPA-DIW mixtures

In semiconductor fabrication, mixtures of isopropyl alcohol (IPA) and deionized water (DIW) are commonly used in wafer cleaning processes due to their superior wetting and drying performance on many types of substrates. To achieve a maximum cleaning performance with reduced IPA consumption, it is of great interest to understand the wetting mechanism of such mixtures. In this work, we investigate the spreading and evaporation process of TPA-DIW drops with different concentrations.