Journal
LASERS IN MANUFACTURING (LIM 2013)
Volume 41, Issue -, Pages 596-602Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.phpro.2013.03.122
Keywords
Cutting; Dicing; Singulation; Si Wafer; picosecond Laser; UKP
Categories
Ask authors/readers for more resources
These days most common way to produce electrical components like LEDs, solar cells or transistors is a batch process. Therefore a lot of identical components are processed parallel on one big wafer and eventually each chip has to be singulated. Currently two dicing technologies have established themselves, which can be devided in mechanical blade sawing and laser based processes with nanosecond lasers. In contrast to these technologies, laser dicing with picosecond lasers offers fundamental advantages like smaller kerf width and marginal heat effected zones. In this paper the cutting process of Si wafers with ps lasers is investigated with regard to optimized process parameters like pulse energy, polarization and overlap. (C) 2013 The Authors. Published by Elsevier B. V. Selection and/or peer-review under responsibility of the German Scientific Laser Society (WLT e.V.)
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available