4.7 Article

Deformation mechanism during dynamic loading of an additively manufactured AlSi10Mg_200C

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2018.03.014

Keywords

Direct metal laser sintering (DMIS); Transmission electron microscopy (TEM); Electron bacicscattering diffraction (EBSD); Dynamic recovery (DRV); Dynamic recrystallization (DRX)

Funding

  1. Natural Sciences and Engineering Research Council of Canada (NSERC) [RGPIN-2016-04221]
  2. New Brunswick Innovation Foundation [(NBIF)-RIF2017-071]

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A DMLS-AlSi10Mg_200C was subjected to dynamic loading at two strain rates. At 1680 s(-1), an ultrafine substructure formed inside the alpha-Al dendrites due to dynamic recovery (DRV). At 4300 s(-1), continuous dynamic recrystallization (CDRX) occurred, followed by DRV inside the DRX grains with development of nanoscale subgrains.

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