New adhesive system based in metals cross-linking methacrylate

This study evaluated the anti-antibiofilm potential of silver methacrylate (Ag) or di-n-butyldimethacrylatetin (Sn) in experimental adhesive systems. Ag and Sn methacrylates were incorporated at 0.5 mol%, 1 mol% and 2 mol% in an adhesive resin. The anti-antibiofilm potential, degree of conversion (DC), microtensile bond strength (mu TBS), water sorption/solubility (W-SR/SL), bonded interfaces pattern (SEM), cytotoxicity and leaching of Ag and Sn ions were evaluated. Data were statistically analyzed considering alpha = 0.05. Only Ag at 2% affected DC and mu TBS. Ag at 1% and 2% and Sn at 1% and 2% showed anti-biofihn potential against Mutans streptococci. Ag at 1% and 2% and Sn at 2% showed a statistically significant difference to the control in W-SR/SL (p < 0.05). The additions of metal methacrylate did not affect cell viability, being the adhesive resins statistically similar to controls. Leached metals of Ag were more than 100x higher than for Sn. Between the concentration tested, Ag and Sn methacrylate at 1% presented an anti-biofihn effect without altering the mechanical properties evaluated.