4.2 Article

Effect of Particle Size and Impact Velocity on Collision Behaviors Between Nano-Scale TiN Particles: MD Simulation

Journal

JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume 18, Issue 6, Pages 4121-4126

Publisher

AMER SCIENTIFIC PUBLISHERS
DOI: 10.1166/jnn.2018.15211

Keywords

MD Simulation; Collision Behavior; TiN; Vacuum Cold Spraying; Particle Bonding; Adhesion Energy

Funding

  1. Science and Technology Planning Program of Jiangxi Provincial Education Department [GJJ161068]
  2. State Key Laboratory for Mechanical Behavior of Materials [20171911]
  3. National Science Foundation of China [51072160, 51561013, 51461022]
  4. National Program for Support of Top-notch Young Professionals
  5. Base and Talent/Outstanding Young Talent Program of Jiujiang Science and Technology

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Inter-particle bonding formation which determines qualities of nano-scale ceramic coatings is influenced by particle collision behaviors during high velocity collision processes. In this study, collision behaviors between nano-scale TiN particles with different diameters were illuminated by using Molecular Dynamics simulation through controlling impact velocities. Results show that nano-scale TiN particles exhibit three states depending on particle sizes and impact velocities, i.e., bonding, bonding with localized fracturing, and rebounding. These TiN particles states are summarized into a parameter selection map providing an overview of the conditions in terms of particle sizes and velocities. Microstructure results show that localized atoms displacement and partial fracture around the impact region are main reasons for bonding formation of nano-scale ceramic particles, which shows differences from conventional particles refining and amorphization. A relationship between the adhesion energy and the rebound energy is established to understand bonding formation mechanism for nano-scale TiN particle collision. Results show that the energy relationship is depended on the particle sizes and impact velocities, and nano-scale ceramic particles can be bonded together as the adhesion energy being higher than the rebound energy.

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