Copper-SiC whiskers composites with interface optimized by Ti3SiC2

In the present work, we propose Ti3SiC2 as the interlayer material to improve the interfacial bonding properties of SiC whiskers-reinforced copper matrix composites. For the first time, Ti3SiC2 coating was in situ fabricated on the surface of SiC whiskers in a molten salt bath. Ti3SiC2-coated SiC whiskers- and bare SiC whiskers-reinforced copper matrix composites were fabricated by spark plasma sintering. The influence of the Ti3SiC2 interlayer on the interfacial properties, mechanical properties, and thermal conductivity of the composites was investigated. The results show that the Ti3SiC2 interlayer can largely improve the interfacial bonding properties of the composites. Therefore, the composites reinforced with Ti3SiC2-coated SiC whiskers exhibit much higher tensile strength than the composites reinforced with bare SiC whiskers. The results also show that the Ti3SiC2 interlayer could decrease the thermal conductivity of the composites in certain extent.