Journal
JOURNAL OF FOOD ENGINEERING
Volume 220, Issue -, Pages 83-88Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.jfoodeng.2017.01.008
Keywords
Vegemite; Marmite; Rheology; 3D printing; Edible; Circuit
Categories
Funding
- University of Wollongong (UOW)
- Australian Research Council (ARC) Centre of Excellence for Electromaterials Science [CE140100012]
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The ability to use Food Layered Manufacturing (FLM) to fabricate attractive food presentations and incorporate additives that can alter texture, nutrition, color, and flavor have made it widely investigated for combatting various issues in the food industry. For a food item to be FLM compatible, it must possess suitable rheological properties to allow for its extrusion and to keep its 3D printed structure. Here, we present a rheological analysis of two commercially available breakfast spreads, Vegemite and Marmite, and show their compatibility with FLM in producing 3D structures onto bread substrates. Furthermore, we demonstrated that these materials can be used to fabricate attractive food designs that can be used for educational activities. The inherent conductivity of the breakfast spreads was used to print edible circuits onto a breadboard. (C) 2017 Elsevier Ltd. All rights reserved.
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