Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 7, Issue 3, Pages 1841-1847Publisher
AMER CHEMICAL SOC
DOI: 10.1021/am507539a
Keywords
high-resolution metal lines; imprint lithography; inkjet printing; copper electoless plating; flexible electronics
Funding
- Multi-University Research Initiative (MURI) program - Office of Naval Research (MURI) [N00014-11-1-0690]
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A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 mu m, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.
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