Journal
JOURNAL OF COMPOSITE MATERIALS
Volume 53, Issue 2, Pages 155-171Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/0021998318781226
Keywords
Stress relaxation; epoxy; cure; viscoelasticity
Categories
Funding
- Natural Sciences and Engineering Research Council of Canada (NSERC)
- Safran group
Ask authors/readers for more resources
This paper presents a viscoelastic temperature- and degree-of-cure-dependent constitutive model for an epoxy resin. Multi-temperature relaxation tests on fully and partially cured rectangular epoxy specimens were conducted in a dynamic mechanical analysis apparatus with a three-point bending clamp. Master curves were constructed from the relaxation test results based on the time-temperature superposition hypothesis. The influence of the degree of cure was included through the cure-dependent glass transition temperature which was used as reference temperature for the shift factors. The model parameters were optimized by minimization of the differences between the model predictions and the experimental data. The model predictions were successfully validated against an independent creep-like strain history over which the temperature varied.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available