Suppression of thermal degradation for interface between carbon fiber and resin matrix in carbon fiber reinforced thermoplastic using hexagonal boron nitride

In this study, suppression of thermal degradation for polyamide 6 (PA6) resin matrix in carbon fiber reinforced thermoplastic (CFRTP) using hexagonal boron nitride (h-BN) was examined. The CFRTP which was composed of h-BN powder, discontinuous carbon fiber (CF) and PA6 had superior thermal degradation resistance of interface between CF and PA6 resin matrix, compared to the conventional one composed of CF and PA6. Thermal degradation test of CFRTP was carried out by microwave irradiation. In case of the conventional CFRTP irradiated with microwave for 15 s, the thermal degradation was progressed at interface between CFs and PA6 resin matrix. On the other hand, in case of the CFRTP with h-BN, the thermal degradation of interface between CF and PA6 resin matrix was not observed after microwave irradiation for 60 s. Moreover, it was indicated that CFRTP with 2 vol.% or more h-BN took longer melting time than conventional one. It was found that the thermal conductive enhancement of resin matrix with h-BN was effective for suppressing the thermal degradation of interface between CF and TP matrix in CFRTP. (c) 2014 The Ceramic Society of Japan. All rights reserved.