Microwave-Assisted Curing of Silicon Carbide-Reinforced Epoxy Composites: Role of Dielectric Properties

In this work, the dielectric properties of epoxy-based composites are significantly improved with the help of the silicon carbide (SiC) filler at an operating frequency of 2.45 GHz to make them ideal candidates for microwave curing. The improvement is due to enhancement of the interfacial polarization because of the presence of the SiC filler. The dielectric properties are measured using the microwave cavity perturbation method. The cavity structure is simulated using the COMSOL@Multiphysics software to verify the measured data in terms of the resonant frequency. Finally, all the SiC-based composites including the neat epoxy resin are heated in the 2.45 GHz microwave oven at 300 W for 20 min. The thermal and mechanical properties of all the cured composites are measured, and the data are compared with their room temperature pre-cured counterparts. The dielectric properties of composite samples using SiC as a reinforcing agent in the epoxy are found to be substantially improved compared with those of the pure epoxy sample, which actually leads to better curing of these composite using the 2.45 GHz microwave system.