Journal
10TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-10)
Volume 1616, Issue -, Pages 140-143Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4897047
Keywords
Heat transfer; Cooling; High heat flux; Phase change heat transfer; Pressing; Bending
Funding
- New & Renewable Energy Core Technology Program of the Korea Institute of Enemy Technology Evaluation and Planning(KETEP) - Ministry of Trade, Industry & Enemy. Republic of Korea [2012T100100631]
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Even when there is a sufficient heat dissipation area from the heat sink to the environment, if the heat flux in the chip package substrate cannot be transferred rapidly to the heat sink, a thermal problem may occur.[1] In this study, a relatively thin CPV module compared to general models was considered. Because four solar chips are mounted on a center column in the CPV module, heat can accumulate rapidly. Therefore, a heat pipe with high thermal conductivity was considered as the heat dissipation method.[2] The heat pipe adopted in the present study is commercially available and has a circular type sintered wick in it. To apply the heat pipe to the CPV module with thin thickness and a central column with 4 solar cells, it should be pressed and bent. The thermal characteristics of the pressed and bent heat pipe was investigated experimentally.
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