Journal
INTERNATIONAL BIODETERIORATION & BIODEGRADATION
Volume 133, Issue -, Pages 17-25Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.ibiod.2018.05.007
Keywords
Aluminum alloy 6061; Microbial localized corrosion; Aspergillus niger fungus; Recurrence plots; Electrochemical impedance spectroscopy
Funding
- National Council of Science and Technology of Mexico (CONACYT) [291062]
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The corrosion behavior of anodized and non-anodized aluminum alloy 6061 in the presence of Aspergillus niger fungus was studied using electrochemical noise, recurrence plots and electrochemical impedance spectroscopy techniques. Corrosion potential measurements were also obtained. The fungus generated organic acids causing microbially induced corrosion of the specimens, which was more evident on non-anodized than on anodized aluminum alloy 6061, showing uniform and localized corrosion and a change in the attack as a function of the fungus growth time. A biomass growth curve was obtained to compare the behavior of anodized and non anodized aluminum alloy 6061. A long-term electron transfer mechanism was proposed for localized corrosion of aluminum alloy 6061.
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