4.6 Article

Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications

Journal

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 66, Issue 4, Pages 1864-1873

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2017.2779496

Keywords

Channel; chip-to-chip; communication; dielectric waveguide (DWG); interconnect; micromachined; microstrip line (MSL); ortho-mode transition (OMT); space division multiplexing (SDM); sub-THz; THz

Funding

  1. National Science Foundation

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This paper presents for the first time the design, fabrication, and demonstration of a dielectric waveguide (DWG)based ortho-mode sub-THz interconnect channel for planar chip-to-chip communications. By combining the proposed new transition of microstrip line with DWG orthogonally, the orthomode transition is constructed to form an ortho-mode channel. The measured minimum insertion losses for the E-y11 mode and the E-x11 mode are 6.6 dB with 20.3-GHz 3-dB bandwidth and 6.5 dB with 55.2-GHz 3-dB bandwidth, respectively. The simulation and measurement results agree well with each other.

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