Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 65, Issue 5, Pages 1771-1773Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2018.2816968
Keywords
Ferroelectric films; hafnium oxide; high-pressure anneal; nonvolatile memory
Funding
- Ministry of Trade, Industry and Energy, Korea [10067789, 10067746]
- Korea Semiconductor Research Consortium support Program for the development of the future semiconductor device
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Hf0.5Zr0.5O2 (HfZrO) thin-film ferroelectric materials have recently drawn considerable attention due to their attractive properties such as large bandgap (> 5 eV), extreme thin thickness (<= 10 nm), and good Si-compatibility. However, high crystallization temperature (600 degrees C-1000 degrees C) and relatively low remanent polarization (P-r) compared to conventional perovskite ferroelectric materials are not suitable for flexible energy related devices, and are insufficient to overcome the barriers of conventional ferroelectric memory. In this paper, we investigated the effect of high-pressure postmetallization annealing (HPPMA) on the ferroelectric properties of the HfZrO metal-ferroelectric-metal (MFM) devices. HfZrO MFM capacitors annealed at 450 degrees C/50 bar shows a P-r value of over 20 mu C/cm(2) which is very advanced P-r value. Based on the short-pulse switching technique, we quantitatively and systematically examined the improved characteristics of HfZrO prepared by HPPMA in terms of coercive field (E-c) and possibly involved interfacial capacitance (C-i).
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