Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 65, Issue 6, Pages 2218-2226Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2017.2786941
Keywords
ANSYS; depressed collector; helix traveling-wave tubes (TWTs); power dissipation; slow-wave structure (SWS); thermal boundary conditions for TWT; thermal contact resistance; thermal simulation
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The thermal simulation using ANSYS was carried out for estimating the maximum temperature and the temperature distribution in a high-average power broadband helix traveling-wave tube (TWT). The simulation was first carried out independently for the subassemblies such as the slow-wave structure, the output coupler, and the depressed collector; and the combined effect on the overall temperature inside the TWT was estimated subsequently. The simulation was carried out using several options of thermal interface resistances such as 100% contact and 50% contact, apart from considering various structural configurations, and an optimal thermal management solution was evolved for the device under consideration.
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