Journal
IEEE TRANSACTIONS ON COMPUTERS
Volume 67, Issue 1, Pages 73-85Publisher
IEEE COMPUTER SOC
DOI: 10.1109/TC.2017.2695179
Keywords
3D MPSoCs; thermal modeling; liquid cooling; electrochemical flow cell
Funding
- YINS RTD project [20NA21 150939]
- Nano-Tera.ch
- SNSF, REPCOOL project [147661]
- Swiss National Science Foundation
- EC [671668]
- ERC [725657]
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Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to address both heat removal and power delivery issues in 3D Multiprocessor Systems-on-Chips (MPSoCs). In this paper we motivate the benefits of FCA in 3D MPSoCs via a qualitative analysis and explore the capabilities of the proposed technology using our extended PowerCool simulator. PowerCool is a tool that performs combined compact thermal and electrochemical simulation of 3D MPSoCs with inter-tier FCA-based cooling and power generation. We validate our electrochemical model against experimental data obtained using a micro-scale FCA, and extend PowerCool with a compact thermal model (3D-ICE) and subthreshold leakage estimation. We show the sensitivity of the FCA cooling and power generation on the design-time (FCA geometry) and run-time (fluid inlet temperature, flow rate) parameters. Our results show that we can optimize the FCA to keep maximum chip temperature below 95 degrees C for an average chip power consumption of 50 W/cm(2) while generating up to 3.6 W per cm(2) of chip area.
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