4.4 Article

Feasibility Study of the Impregnation of a No-Insulation HTS Coil Using Solder

Journal

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2017.2773831

Keywords

Charge-discharge; no-insulation (NI) coil; solder impregnation; sudden-discharge

Funding

  1. National Key Research and Development Program [2017YFB0902301]

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This paper reports the feasibility of the impregnation of no-insulation (NI) high-temperature superconducting (HTS) coils using solder. NI coils are widely studied and used in many situations. To utilize an HTS coil under high mechanical loads such as field coils for rotating machines, the HTS tapes must be stabilized mechanically. Epoxy impregnation is a common method to protect the HTS field from mechanical disturbances caused by the magnetic field and rotational vibration of the rotor to enhance themechanical stability. However, traditional epoxy resins are electrical insulating materials which might cause the turn-to-turn contact resistance of NI coils to increase. Therefore, we proposed a new kind of impregnation method using the electrically conductive material, solder. Two coils were fabricated and tested for comparison. One is the NI coil without impregnation and the other is the NI coil impregnated with solder. The charge-discharge and suddendischarge tests were performed in liquid nitrogen at 77 K. The experimental results were studied with equivalent circuit analyses. The results of this paper could provide useful data for the application of solder impregnated NI HTS coils.

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